| Characterization and modeling of the susceptibility of integrated circuits to conducted electromagnetic disturbances up to 1 GHz I Chahine, M Kadi, E Gaboriaud, A Louis, B Mazari IEEE Transactions on Electromagnetic Compatibility 50 (2), 285-293, 2008 | 77 | 2008 |
| Characterization of electromagnetic fields close to microwave devices using electric dipole probes L Bouchelouk, Z Riah, D Baudry, M Kadi, A Louis, B Mazari International Journal of RF and Microwave Computer‐Aided Engineering: Co …, 2008 | 45 | 2008 |
| A 3-D near-field modeling approach for electromagnetic interference prediction H Shall, Z Riah, M Kadi IEEE Transactions on Electromagnetic Compatibility 56 (1), 102-112, 2013 | 36 | 2013 |
| Determination of the compaction of hot mix asphalt using high-frequency electromagnetic methods C Fauchard, B Li, L Laguerre, B Heritier, N Benjelloun, M Kadi NDT & E International 60, 40-51, 2013 | 34 | 2013 |
| Plane wave spectrum theory applied to near-field measurements for electromagnetic compatibility investigations D Baudry, M Kadi, Z Riah, C Arcambal, Y Vives-Gilabert, A Louis, ... IET Science, Measurement & Technology 3 (1), 72-83, 2009 | 32 | 2009 |
| Modeling IC snapback characteristics under electrostatic discharge stress A Ramanujan, M Kadi, J Trémenbert, F Lafon, B Mazari IEEE transactions on electromagnetic compatibility 51 (4), 901-908, 2009 | 23 | 2009 |
| A novel approach for modeling near-field coupling with PCB traces H Shall, Z Riah, M Kadi IEEE Transactions on Electromagnetic Compatibility 56 (5), 1194-1201, 2014 | 20 | 2014 |
| Robustness of 4H-SiC 1200 V Schottky diodes under high electrostatic discharge like human body model stresses: An in-depth failure analysis P Denis, P Dherbécourt, O Latry, C Genevois, F Cuvilly, M Brault, M Kadi Diamond and related materials 44, 62-70, 2014 | 16 | 2014 |
| Failure analysis of aluminum electrolytic capacitors based on electrical and physicochemical characterizations C Lachkar, M Kadi, JP Kouadio, M Presle, S El Yousfi, JF Goupy, ... 2017 IEEE International Reliability Physics Symposium (IRPS), 5C-1.1-5C-1.7, 2017 | 15 | 2017 |
| Post-processing of electric field measurements to calibrate a near-field dipole probe Z Riah, D Baudry, M Kadi, A Louis, B Mazari IET science, measurement & technology 5 (2), 29-36, 2011 | 14 | 2011 |
| Broad band PCB probes for near field measurements N Sivaraman, F Ndagljlmana, M Kadi, Z Riah 2017 International Symposium on Electromagnetic Compatibility-EMC EUROPE, 1-5, 2017 | 12 | 2017 |
| High-frequency characterization and modeling of EMI filters under temperature variations F Hami, H Boulzazen, M Kadi IEEE Transactions on Electromagnetic Compatibility 59 (6), 1906-1915, 2017 | 12 | 2017 |
| Prediction of 3D-near field coupling between a toroïdal inductor and a transmission line H Shall, Z Riah, M Kadi 2013 IEEE International Symposium on Electromagnetic Compatibility, 651-656, 2013 | 12 | 2013 |
| Evolution of CV and IV characteristics for a commercial 600 V GaN GIT power device under repetitive short-circuit tests JZ Fu, F Fouquet, M Kadi, P Dherbécourt Microelectronics Reliability 88, 652-655, 2018 | 11 | 2018 |
| Using neural networks for predicting the integrated circuits susceptibility to conducted electromagnetic disturbances I Chahine, M Kadi, E Gaboriaud, A Louis, B Mazari 2007 18th International Zurich Symposium on Electromagnetic Compatibility, 13-16, 2007 | 11 | 2007 |
| Modelling of integrated circuit susceptibility to conducted electromagnetic disturbances using neural networks theory I Chahine, M Kadi, E Gaboriaud, C Maziere, A Louis, B Mazari Electronics Letters 42 (18), 1, 2006 | 9 | 2006 |
| Experimental study of 600V GaN transistor under the short-circuit aging tests JZ Fu, F Fouquet, M Kadi, P Dherbécourt 2018 19th IEEE Mediterranean Electrotechnical Conference (MELECON), 249-253, 2018 | 8 | 2018 |
| Study of electromagnetic field stress impact on SiGe heterojunction bipolar transistor performance A Alaeddine, M Kadi, K Daoud, H Maanane, P Eudeline International Journal of Microwave and Wireless Technologies 1 (6), 475-482, 2009 | 8 | 2009 |
| Effects of electromagnetic near-field stress on SiGe HBT’s reliability A Alaeddine, M Kadi, K Daoud, B Mazari Microelectronics Reliability 49 (9-11), 1029-1032, 2009 | 8 | 2009 |
| Failure investigation of packaged SiC-diodes after thermal storage in extreme operating condition O Latry, P Dherbecourt, P Denis, F Cuvilly, M Kadi Engineering Failure Analysis 83, 185-192, 2018 | 7 | 2018 |
Francois FOUQUETEnseignant ChercheurVerified email at esigelec.fr
