| A review of interconnection technologies for improved crystalline silicon solar cell photovoltaic module assembly MT Zarmai, NN Ekere, CF Oduoza, EH Amalu Applied energy 154, 173-182, 2015 | 190 | 2015 |
| A review of photovoltaic module technologies for increased performance in tropical climate OO Ogbomo, EH Amalu, NN Ekere, PO Olagbegi Renewable and Sustainable Energy Reviews 75, 1225-1238, 2017 | 175 | 2017 |
| Thermal interface materials for automotive electronic control unit: Trends, technology and R&D challenges KC Otiaba, NN Ekere, RS Bhatti, S Mallik, MO Alam, EH Amalu Microelectronics Reliability 51 (12), 2031-2043, 2011 | 164 | 2011 |
| Thermal fatigue life of ball grid array (BGA) solder joints made from different alloy compositions JA Depiver, S Mallik, EH Amalu Engineering Failure Analysis 125, 105447, 2021 | 91 | 2021 |
| Effect of operating temperature on degradation of solder joints in crystalline silicon photovoltaic modules for improved reliability in hot climates OO Ogbomo, EH Amalu, NN Ekere, PO Olagbegi Solar Energy 170, 682-693, 2018 | 91 | 2018 |
| High temperature reliability of lead-free solder joints in a flip chip assembly EH Amalu, NN Ekere Journal of Materials Processing Technology 212 (2), 471-483, 2012 | 90 | 2012 |
| Evaluation of thermo-mechanical damage and fatigue life of solar cell solder interconnections MT Zarmai, NN Ekere, CF Oduoza, EH Amalu Robotics and Computer-Integrated Manufacturing 47, 37-43, 2017 | 72 | 2017 |
| Modelling evaluation of Garofalo-Arrhenius creep relation for lead-free solder joints in surface mount electronic component assemblies EH Amalu, NN Ekere Journal of Manufacturing Systems 39, 9-23, 2016 | 68 | 2016 |
| Numerical study on thermal impacts of different void patterns on performance of chip-scale packaged power device KC Otiaba, RS Bhatti, NN Ekere, S Mallik, MO Alam, EH Amalu, M Ekpu Microelectronics Reliability 52 (7), 1409-1419, 2012 | 67 | 2012 |
| A review of technology, materials and R&D challenges of upper limb prosthesis for improved user suitability R Brack, EH Amalu Journal of Orthopaedics 23, 88-96, 2021 | 66 | 2021 |
| Evaluation of rheological properties of lead-free solder pastes and their relationship with transfer efficiency during stencil printing process EH Amalu, NN Ekere, S Mallik Materials & Design 32 (6), 3189-3197, 2011 | 66 | 2011 |
| Effective solder for improved thermo-mechanical reliability of solder joints in a ball grid array (BGA) soldered on printed circuit board (PCB) JA Depiver, S Mallik, EH Amalu Journal of Electronic Materials 50, 263-282, 2021 | 54 | 2021 |
| Optimization of thermo-mechanical reliability of solder joints in crystalline silicon solar cell assembly MT Zarmai, NN Ekere, CF Oduoza, EH Amalu Microelectronics Reliability 59, 117-125, 2016 | 54 | 2016 |
| Thermal control of crystalline silicon photovoltaic (c-Si PV) module using Docosane phase change material (PCM) for improved performance EH Amalu, OA Fabunmi Solar Energy 234, 203-221, 2022 | 50 | 2022 |
| High temperature electronics: R&D challenges and trends in materials, packaging and interconnection technology EH Amalu, NN Ekere, RS Bhatti 2009 2nd International Conference on Adaptive Science & Technology (ICAST …, 2009 | 49 | 2009 |
| Thermo-mechanical deformation degradation of crystalline silicon photovoltaic (c-Si PV) module in operation EH Amalu, DJ Hughes, F Nabhani, J Winter Engineering Failure Analysis 84, 229-246, 2018 | 39 | 2018 |
| Effect of coefficient of thermal expansion (CTE) mismatch of solder joint materials in photovoltaic (PV) modules operating in elevated temperature climate on the joint's damage OO Ogbomo, EH Amalu, NN Ekere, PO Olagbegi Procedia Manufacturing 11, 1145-1152, 2017 | 37 | 2017 |
| A study of SnAgCu solder paste transfer efficiency and effects of optimal reflow profile on solder deposits EH Amalu, WK Lau, NN Ekere, RS Bhatti, S Mallik, KC Otiaba, G Takyi Microelectronic Engineering 88 (7), 1610-1617, 2011 | 37 | 2011 |
| Damage of lead-free solder joints in flip chip assemblies subjected to high-temperature thermal cycling EH Amalu, NN Ekere Computational materials science 65, 470-484, 2012 | 32 | 2012 |
| Investigation of effects of heat sinks on thermal performance of microelectronic package M Ekpu, R Bhatti, N Ekere, S Mallik, E Amalu, K Otiaba 3rd IEEE International Conference on Adaptive Science and Technology (ICAST …, 2011 | 30 | 2011 |
Sabuj MallikProfessor & Head of School of Engineering & the Built Environment, Buckinghamshire New University UKVerified email at bucks.ac.uk
![Dr Emeka Amalu [BEng (Hons), MEng, PhD, PG Cert HE, CEng, MIMechE, MIET, FHEA]](https://scholar.googleusercontent.com/citations?view_op=view_photo&user=MVa79dgAAAAJ&citpid=2)