Effects of graphite microstructure evolution on the anisotropic thermal conductivity of expanded graphite/paraffin phase change materials and their thermal energy storage … XL Wang, B Li, ZG Qu, JF Zhang, ZG Jin International Journal of Heat and Mass Transfer 155, 119853, 2020 | 79 | 2020 |
Improved high temperature strength of copper-graphene composite material X Wang, J Li, Y Wang Materials Letters 181, 309-312, 2016 | 46 | 2016 |
Anisotropic thermal expansion coefficient of multilayer graphene reinforced copper matrix composites X Wang, X Wang, M Liu, MA Crimp, Y Wang, Z Qu Journal of Alloys and Compounds 755, 114-122, 2018 | 41 | 2018 |
Improvement of interfacial bonding and mechanical properties of Cu-Al2O3 composite by Cr-nanoparticle-induced interfacial modification X Wang, J Li, Y Zhang, Y Wang Journal of Alloys and Compounds 695, 2124–2130, 2017 | 38 | 2017 |
A reverse thermal cloak design method based on inverse problem theory J Guo, Z Qu, X Wang ES Energy & Environment 7 (3), 71-83, 2020 | 31 | 2020 |
Synergetic strengthening effects on copper matrix induced by Al2O3 particle revealed from micro-scale mechanical deformation and microstructure evolutions X Wang, Y Wang, Y Su, Z Qu Ceramics International 45 (12), 14889-14895, 2019 | 31 | 2019 |
A molecular model of PEMFC catalyst layer: Simulation on reactant transport and thermal conduction W Wang, Z Qu, X Wang, J Zhang Membranes 11 (2), 148, 2021 | 25 | 2021 |
Elastic recovery induced strengthening effect in copper/multilayer-graphene interface regions revealed by instrumental nanoindentation X Wang, Y Su, S Han, MA Crimp, Y Wang, Y Wang Composites Part B: Engineering 216, 108832, 2021 | 16 | 2021 |
Enhancing mechanism of interfacial metal element on the thermal transport across Cu-graphene interfaces revealed by molecular dynamics simulations X Wang, X Wang, Z Wang, Y Guo, Y Wang Materials Today Communications 25, 101431, 2020 | 16 | 2020 |
Improving the mechanical performance of CuCr alloy by dissolving Cu in the Cr second phase L Shan, X Wang, Y Chang, Y Wang Materials Characterization 176, 111104, 2021 | 12 | 2021 |
Extension of solid solubility and structural evolution in nano-structured Cu-Cr solid solution induced by high-energy milling L Shan, X Wang, Y Wang Materials 13 (23), 5532, 2020 | 11 | 2020 |
Tuning thermal expansion coefficient of copper-multilayer graphene thermal management materials through tailoring interfacial microstructure X Wang, Y Liu, X Wang, Y Wang, T Lai, G Ren Journal of Alloys and Compounds 862, 158709, 2021 | 9 | 2021 |
The red deer antler: Bioinspired design of an AlSi composite with a fenestrated network-particle structure Z Wang, Y Zhang, S Jiang, J Wang, D Du, X Wang, Y Wang Journal of Materiomics 6 (3), 545-556, 2020 | 9 | 2020 |
Prolonged yield platform in bioinspired three dimensional carbon materials derived from crack deflection X Wang, Z Qu, G Ren, C Feng, F Cheng Materials Letters 270, 127759, 2020 | 8 | 2020 |
Modulation of columnar crystals of magnetron sputtered Ti thin films H Zhang, X Li, J Su, X Wang, L Ma, J Xue, Y Li, Z Song Thin Solid Films 689, 137512, 2019 | 6 | 2019 |
Preparation and Properties of a Flexible Al2O3/Al/Al2O3 Composite Y Tong, Z Zhou, H Cai, X Wang, Y Wang Advances in Materials Science and Engineering 2018, 2018 | 5 | 2018 |
Cu-Al_2O_3 复合材料的制备技术及研究现状 王学亮, 王亚平 电工材料, 27-32, 2014 | 5 | 2014 |
Melting suspending of Ag nano-particles monitored by molecular dynamics simulation X Wang, X Wang, M Liu, Y Wang Chemical Physics 527, 110459, 2019 | 4 | 2019 |
Thermal transport across Cu-Metal-Carbon nanotube interfaces enhanced by effective interfacial interaction X Wang, X Wang, Z Wang, Y Guo, Y Wang Chemical Physics 542, 111019, 2021 | 2 | 2021 |
Survey of transient process during melting of silver below the equilibrium melting point M Liu, Q Fu, X Wang, D Xie, Y Wang The Journal of Chemical Physics 151 (24), 2019 | 1 | 2019 |