Sabuj Mallik
Sabuj Mallik
Professor & Head of School of Engineering & the Built Environment, Buckinghamshire New University UK
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Investigation of thermal management materials for automotive electronic control units
S Mallik, N Ekere, C Best, R Bhatti
Applied Thermal Engineering 31 (2-3), 355-362, 2011
Thermal interface materials for automotive electronic control unit: Trends, technology and R&D challenges
KC Otiaba, NN Ekere, RS Bhatti, S Mallik, MO Alam, EH Amalu
Microelectronics Reliability 51 (12), 2031-2043, 2011
Rheological characterisation and printing performance of Sn/Ag/Cu solder pastes
R Durairaj, S Ramesh, S Mallik, A Seman, N Ekere
Materials & Design 30 (9), 3812-3818, 2009
Finite element analysis of the effect of silver content for Sn–Ag–Cu alloy compositions on thermal cycling reliability of solder die attach
KC Otiaba, RS Bhatti, NN Ekere, S Mallik, M Ekpu
Engineering Failure Analysis 28, 192-207, 2013
Rheological characterisation of solder pastes and isotropic conductive adhesives used for flip-chip assembly
R Durairaj, S Mallik, A Seman, A Marks, NN Ekere
Journal of materials processing technology 209 (8), 3923-3930, 2009
Thermal fatigue life of ball grid array (BGA) solder joints made from different alloy compositions
JA Depiver, S Mallik, EH Amalu
Engineering Failure Analysis 125, 105447, 2021
Numerical study on thermal impacts of different void patterns on performance of chip-scale packaged power device
KC Otiaba, RS Bhatti, NN Ekere, S Mallik, MO Alam, EH Amalu, M Ekpu
Microelectronics Reliability 52 (7), 1409-1419, 2012
Evaluation of rheological properties of lead-free solder pastes and their relationship with transfer efficiency during stencil printing process
EH Amalu, NN Ekere, S Mallik
Materials & Design 32 (6), 3189-3197, 2011
Fatigue life of lead-free solder thermal interface materials at varying bond line thickness in microelectronics
M Ekpu, R Bhatti, MI Okereke, S Mallik, K Otiaba
Microelectronics Reliability 54 (1), 239-244, 2014
Effective solder for improved thermo-mechanical reliability of solder joints in a ball grid array (BGA) soldered on printed circuit board (PCB)
JA Depiver, S Mallik, EH Amalu
Journal of Electronic Materials 50, 263-282, 2021
Solder joint failures under thermo-mechanical loading conditions–A review
J Depiver, S Mallik, D Harmanto
Advances in Materials and Processing Technologies 7 (1), 1-26, 2021
A study of SnAgCu solder paste transfer efficiency and effects of optimal reflow profile on solder deposits
EH Amalu, WK Lau, NN Ekere, RS Bhatti, S Mallik, KC Otiaba, G Takyi
Microelectronic Engineering 88 (7), 1610-1617, 2011
The effect of wall-slip formation on the rheological behaviour of lead-free solder pastes
R Durairaj, LW Man, NN Ekere, S Mallik
Materials & Design 31 (3), 1056-1062, 2010
Investigation of effects of heat sinks on thermal performance of microelectronic package
M Ekpu, R Bhatti, N Ekere, S Mallik, E Amalu, K Otiaba
3rd IEEE International Conference on Adaptive Science and Technology (ICAST …, 2011
Solder paste characterisation: towards the development of quality control (QC) tool
R Durairaj, S Mallik, NN Ekere
Soldering & Surface mount technology 20 (3), 34-40, 2008
CFD simulation of solder paste flow and deformation behaviours during stencil printing process.
V Thakur, S Mallik, V Vuppala
International Journal of Recent Advances in Mechanical Engineering, 2015
Stencil printing behavior of lead-free Sn-3Ag-0.5 Cu solder paste for wafer level bumping for sub-100 μm size solder bumps
S Kumar, S Mallik, N Ekere, J Jung
Metals and Materials International 19, 1083-1090, 2013
Advanced thermal management materials for heat sinks used in microelectronics
M Ekpu, R Bhatti, N Ekere, S Mallik
18th European Microelectronics & Packaging Conference, 1-8, 2011
Evaluating solder paste behaviours through rheological test methods and their correlation to the printing performance
S Mallik, M Schmidt, R Bauer, NN Ekere
Soldering & surface mount technology 22 (4), 42-49, 2010
Influence of solder paste components on rheological behaviour
S Mallik, M Schmidt, R Bauer, NN Ekere
2008 2nd Electronics System-Integration Technology Conference, 1135-1140, 2008
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