Seung Hyun Kim
Seung Hyun Kim
University of Illinois at Urbana-Champaign
Verified email at
Cited by
Cited by
Inverse metal-assisted chemical etching produces smooth high aspect ratio InP nanostructures
SH Kim, PK Mohseni, Y Song, T Ishihara, X Li
Nano letters 15 (1), 641-648, 2015
GaAs pillar array-based light emitting diodes fabricated by metal-assisted chemical etching
PK Mohseni, S Hyun Kim, X Zhao, K Balasundaram, J Dong Kim, L Pan, ...
Journal of applied physics 114 (6), 2013
3D hierarchical architectures based on self-rolled-up silicon nitride membranes
P Froeter, X Yu, W Huang, F Du, M Li, I Chun, SH Kim, KJ Hsia, JA Rogers, ...
Nanotechnology 24 (47), 475301, 2013
Ultra-high aspect ratio InP junctionless FinFETs by a novel wet etching method
Y Song, PK Mohseni, SH Kim, JC Shin, T Ishihara, I Adesida, X Li
IEEE Electron Device Letters 37 (8), 970-973, 2016
InP FinFETs with damage-free and record high-aspect-ratio (45∶ 1) fins fabricated by metal-assisted chemical etching
Y Song, PK Mohseni, SH Kim, JC Shin, C Zhang, K Chabak, X Li
2015 73rd Annual Device Research Conference (DRC), 253-254, 2015
Inverse metal-assisted chemical etching of indium phosphide with sub-20 nm scalability
SH Kim
University of Illinois at Urbana-Champaign, 2014
Observation of Plasma Propagation in an Array of Microchannels
JH Cho, SR Kim, SJ Park, JG Eden
APS Annual Gaseous Electronics Meeting Abstracts, DT3. 004, 2011
The system can't perform the operation now. Try again later.
Articles 1–7