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Dr Mathias Ekpu
Dr Mathias Ekpu
Associate Professor, Mechanical Engineering Department, Delta State University, Abraka
Verified email at delsu.edu.ng - Homepage
Title
Cited by
Cited by
Year
Finite element analysis of the effect of silver content for Sn–Ag–Cu alloy compositions on thermal cycling reliability of solder die attach
KC Otiaba, RS Bhatti, NN Ekere, S Mallik, M Ekpu
Engineering Failure Analysis 28, 192-207, 2013
752013
Numerical study on thermal impacts of different void patterns on performance of chip-scale packaged power device
KC Otiaba, RS Bhatti, NN Ekere, S Mallik, MO Alam, EH Amalu, M Ekpu
Microelectronics Reliability 52 (7), 1409-1419, 2012
602012
Fatigue life of lead-free solder thermal interface materials at varying bond line thickness in microelectronics
M Ekpu, R Bhatti, MI Okereke, S Mallik, K Otiaba
Microelectronics Reliability 54 (1), 239-244, 2014
532014
Investigation of effects of heat sinks on thermal performance of microelectronic package
M Ekpu, R Bhatti, N Ekere, S Mallik, E Amalu, K Otiaba
3rd IEEE International Conference on Adaptive Science and Technology (ICAST …, 2011
232011
Advanced thermal management materials for heat sinks used in microelectronics
M Ekpu, R Bhatti, N Ekere, S Mallik
18th European Microelectronics & Packaging Conference, 1-8, 2011
222011
Thermal effects of die-attach voids location and style on performance of chip level package
KC Otiaba, RS Bhatti, NN Ekere, S Mallik, EH Amalu, M Ekpu
3rd IEEE International Conference on Adaptive Science and Technology (ICAST …, 2011
182011
Effects of thermal interface materials (solders) on thermal performance of a microelectronic package
M Ekpu, R Bhatti, N Ekere, S Mallik, K Otiaba
2012 Symposium on Design, Test, Integration and Packaging of MEMS/MOEMS, 154-159, 2012
172012
Finite Element Analysis of the Effect of Fin Geometry on Thermal Performance of Heat Sinks in Microelectronics
M Ekpu
Journal of Applied Science and Environmental Management 23 (11), 2059-2063, 2019
152019
Investigating the Reliability of SnAgCu Solder Alloys at Elevated Temperatures in Microelectronic Applications
M Ekpu
Journal of Electronic Materials 50, 4433-4441, 2021
62021
Power Production using Natural Gas in Nigeria: Trends, Challenges and Way Forward
M Ekpu, OB Obadina
Nigerian Research Journal of Engineering and Environmental Sciences 5 (2 …, 2020
62020
The effect of thermal constriction on heat management in a microelectronic application
M Ekpu, R Bhatti, MI Okereke, S Mallik, K Otiaba
Microelectronics Journal 45 (2), 159-166, 2014
52014
Prediction and optimization of design parameters of microelectronic heat sinks
M Ekpu, R Bhatti, MI Okereke, S Mallik, KC Otiaba
Journal of Emerging Trends in Engineering and Applied Sciences 4 (3), 493-500, 2013
52013
Thermal effect of cylindrical heat sink on heat management in LED applications
M Ekpu, EA Ogbodo, F Ngobigha, JE Njoku
Energies 15 (20), 7583, 2022
42022
Effect of Tensile Load on the Mechanical Properties of AlSiC Composite Materials using ANSYS Design Modeller
M Ekpu
Nigerian Journal of Technological Development (NJTD) 17 (4), 301-305, 2020
32020
Fatigue life analysis of Sn96. 5Ag3. 0Cu0. 5 solder thermal interface material of a chip-heat sink assembly in microelectronic applications
M Ekpu, R Bhatti, MI Okereke, KC Otiaba
International Symposium on Microelectronics 2013 (1), 000473-000477, 2013
32013
Optimisation of a Microelectronic Assembly Package using Response Surface Methodology
M Ekpu
Nigerian Journal of Technology (NIJOTECH) 39 (4), 1058-1065, 2020
22020
Effect of Fins Arrangement on Thermal Performance in Microelectronics Devices
M Ekpu
Journal of Applied Sciences and Environmental Management 22 (11), 1797-1800, 2018
22018
Comparative study of the effects of coalesced and distributed solder die attach voids on thermal resistance of packaged semiconductor device
KC Otiaba, RS Bhatti, NN Ekere, M Ekpu, J Adeyemi
2011 17th International Workshop on Thermal Investigations of ICs and …, 2011
22011
Preliminary Investigation of African Oil Bean Husk as a Feasible Fluid-Loss Control Agent in Drilling Muds
EO Ifeanyi, SC Ikpeseni, MC Ogbue, M Ekpu, LC Edomwonyi-Otu
NIPES Journal of Science and Technology Research 5 (1), 218-229, 2023
12023
Effect of Elevated Temperatures on SAC305 Solder Alloy Thermal Interface Material in a Microelectronic Assembly
M Ekpu
FUOYE Journal of Engineering and Technology 6 (1), 77-81, 2021
12021
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