Aaron M. Forster
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Materials testing standards for additive manufacturing of polymer materials: state of the art and standards applicability
AM Forster, AM Forster
US Department of Commerce, National Institute of Standards and Technology, 2015
Improving performance of dental resins by adding titanium dioxide nanoparticles
J Sun, AM Forster, PM Johnson, N Eidelman, G Quinn, G Schumacher, ...
Dental Materials 27 (10), 972-982, 2011
Robust conductive mesoporous carbon–silica composite films with highly ordered and oriented orthorhombic structures from triblock-copolymer template co-assembly
L Song, D Feng, CG Campbell, D Gu, AM Forster, KG Yager, N Fredin, ...
Journal of Materials Chemistry 20 (9), 1691-1701, 2010
In situ observation of the indentation-induced phase transformation of silicon thin films
YB Gerbig, CA Michaels, AM Forster, RF Cook
Physical Review B 85 (10), 104102, 2012
Long term stability of UHMWPE fibers
AL Forster, J Chin, JS Peng, K Kang, K Rice, M Al-Sheikhly
Mechanics of Composite and Multi-functional Materials, Volume 7: Proceedings …, 2016
Effects of filler type and content on mechanical properties of photopolymerizable composites measured across two-dimensional combinatorial arrays
S Lin-Gibson, L Sung, AM Forster, H Hu, Y Cheng, NJ Lin
Acta Biomaterialia 5 (6), 2084-2094, 2009
Combinatorial approach to characterizing epoxy curing
N Eidelman, D Raghavan, AM Forster, EJ Amis, A Karim
Macromolecular rapid communications 25 (1), 259-263, 2004
Lightweight, flexible, high-performance carbon nanotube cables made by scalable flow coating
F Mirri, ND Orloff, AM Forster, R Ashkar, RJ Headrick, EA Bengio, CJ Long, ...
ACS applied materials & interfaces 8 (7), 4903-4910, 2016
Scratch behavior of nano-alumina/polyurethane coatings
LP Sung, J Comer, AM Forster, H Hu, B Floryancic, L Brickweg, ...
Journal of Coatings Technology and Research 5, 419-430, 2008
Multiscale mechanical characterization of biomimetic physically associating gels
TF Juliano, AM Forster, PL Drzal, T Weerasooriya, P Moy, ...
Journal of materials research 21 (8), 2084-2092, 2006
Cubic Silsesquioxanes as a Green, High‐Performance Mold Material for Nanoimprint Lithography
HW Ro, V Popova, L Chen, AM Forster, Y Ding, KJ Alvine, DJ Krug, ...
Advanced Materials 23 (3), 414-420, 2011
Particle-based characterization of Ottawa sand: Shape, size, mineralogy, and elastic moduli
ST Erdoğan, AM Forster, PE Stutzman, EJ Garboczi
Cement and concrete composites 83, 36-44, 2017
Effect of temperature on the frictional forces between polystyrene brushes
AM Forster, JW Mays, SM Kilbey
Journal of Polymer Science Part B: Polymer Physics 44 (4), 649-655, 2006
X-ray CT imaging and finite element computations of the elastic properties of a rigid organic foam compared to experimental measurements: insights into foam variability
K Natesaiyer, C Chan, S Sinha-Ray, D Song, CL Lin, JD Miller, ...
Journal of materials science 50, 4012-4024, 2015
Imaging the molecular structure of polyethylene blends with broadband coherent Raman microscopy
YJ Lee, CR Snyder, AM Forster, MT Cicerone, W Wu
ACS Macro Letters 1 (11), 1347-1351, 2012
Evaluation of temperature-dependent adhesive performance via combinatorial probe tack measurements
S Moon, A Chiche, AM Forster, W Zhang, CM Stafford
Review of scientific instruments 76 (6), 062210, 2005
Multiscale metrologies for process optimization of carbon nanotube polymer composites
B Natarajan, ND Orloff, R Ashkar, S Doshi, K Twedt, A Krishnamurthy, ...
Carbon 108, 381-393, 2016
Indentation device for in situ Raman spectroscopic and optical studies
YB Gerbig, CA Michaels, AM Forster, JW Hettenhouser, WE Byrd, ...
Review of Scientific Instruments 83 (12), 125106, 2012
Thermoviscoelastic analysis and creep testing of ambient temperature cure epoxies used in adhesive anchor applications
J Chin, A Forster, J Ocel, J Hartmann, P Fuchs, D Hunston
Journal of Materials in Civil Engineering 22 (10), 1039-1046, 2010
A multilens measurement platform for high-throughput adhesion measurements
AM Forster, W Zhang, AJ Crosby, CM Stafford
Measurement Science and Technology 16 (1), 81, 2004
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